Qualcomm is developing the Snapdragon X2 processor for Windows PCs, featuring up to 18 Oryon V3 cores and designated as SC8480XP. It will utilize a system-in-package (SiP) design, integrating RAM and flash storage to enhance data transfer speeds and energy efficiency. Potential configurations may include up to 48GB of RAM and a 1TB SSD. The Snapdragon X2 is expected to be a high-TDP variant, with thermal management innovations including an all-in-one liquid cooling solution. It is branded as “Snapdragon X2 Ultra Premium” and aims to compete with Intel, AMD, and Apple's M-series chips. Qualcomm's Snapdragon X Elite Gen 2 will incorporate the Oryon v3 CPU, following the Oryon v2, which offers a 30% performance boost and 57% increase in power efficiency. The Snapdragon X2 could impact the Windows on ARM ecosystem, although challenges with software compatibility and market adoption remain.